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Own new equipment
International brands Equipment refurbishment
Semiconductor Materials
Process Line
CMP
Wafer Thinning machines
Grinding and Polishing integrated machines
Wafer Dicing machine
Electroplating equipment
WET - Fully automatic chemical nickel and palladium equipment
WET - Fully automatic cleaning equipment
Single Wafer Cleaner
WET - Fully automatic wet glue removal equipment
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ASHER
Liquid supply system
Chiller/Heat Exchanger
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DRY ETCH
LITHOGRAPHY
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STRIPPER
FURNACE
WET
RTP
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Own new equipment
International brands Equipment refurbishment
Semiconductor Materials
Process line
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International brands Equipment refurbishment
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THIN FILM
DRY ETCH
LITHOGRAPHY
TRACK
IMPLANT
CMP
STRIPPER
FURNACE
WET
RTP
METROLOGY
ECD
OTHER
THIN FILM
DRY ETCH
LITHOGRAPHY
TRACK
IMPLANT
CMP
STRIPPER
FURNACE
WET
RTP
METROLOGY
ECD
OTHER
ECD-6/8inch
LAM C2 SABRE
consult
ECD-12inch
LAM
SABRE 3D
consult
International brands Equipment refurbishment
GMCs Brand
Semiconductor Materials
Process Line
